Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

SKU: MZ1193B4134M
ISBN: 9781119314134
Edition: Unknown
Condition: New
Category:
Language: en
Publication date: 2019-02-12
Page: 576

Original price was: $208.08.Current price is: $154.13.

3 People watching this product now!

Description

This product page includes key details such as author, publisher, ISBN, edition, binding, and condition. Please refer to the product details above for the most accurate information about this title.

Welcome to Mazi Books

Take 10% OFF your first purchase.

NEW10

Payment Methods:

Customer Reviews

Reviews

There are no reviews yet.

Be the first to review “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies”

Your email address will not be published. Required fields are marked *

Related Products

Coders’ Dictionary

Original price was: $139.21.Current price is: $103.12.

ICD-10-CM Expert for Physicians 2026

Original price was: $156.44.Current price is: $115.88.

ICD-10-CM EXPERT FOR HOSPITALS

Original price was: $165.67.Current price is: $122.72.

The Earth and Its Peoples, Brief: A Global History

Original price was: $183.18.Current price is: $135.69.

HCPCS LEVEL II

Original price was: $87.10.Current price is: $64.52.

Recently Viewed